The 11th PIC International builds on the strengths of the event’s previous editions, with around 40 leaders from industry and academia delivering presentations falling within four key themes:

• Foundations of PIC design: materials, devices and processes
• Connectivity and scalability for secure, high-speed data networks
• Emerging applications: photonics for sensing, imaging and beyond
• Future computing: PICs for photonic processing, quantum computers, and neural networks

Conference attendees will gain greater insights into device technologies while learning of the latest opportunities and trends within the PIC industry. Delegates will also discover significant advances in tools and processes that deliver enhanced performance and higher yields.

Additionally, the two-day event provides an excellent opportunity for attendees to meet a wide variety of key players within the community, from investors and analysts to fab engineers and managers.

PIC International is part of AngelTech, which delivers a portfolio of insightful, informative, highly valued chip-level conferences. Bringing together an Innovation Summit and three conferences with more than 120 presentations, more than 700 delegates and over 80 exhibitors, AngelTech is the premier global event covering compound semiconductor, photonic integrated circuit and power electronic technologies. With a significant overlap between the three conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.